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SMT Progress | Item | Mass Production Capability |
Solde Paste Print | Max PCB size can be processed | 900*600mm² |
Max PCB WT can be processed | 8kg | |
±25μm | ||
System calibration repeatability | ±10μm | |
Squeegee pressure detection | Pressure closed loop control system | |
SPI (Solder Paste Inspection) | Min Detectable solder ball pitch | 100μm |
X-Y axis accuracy | 0.5μm | |
False positive rate | ≤0.1% | |
Mount | Min-Max machinable components | 0.3*0.15 mm²--200*125 mm² |
Max Height of machinable components | 25.4mm | |
Max Weight of machinable components | 100g | |
BGA/CSP Min ball spacing, ball diameter | 0.30mm,0.15mm | |
Mount accuracy | ±22μm),±0.05 | |
Min-Max PCB size can be processed | 50*50 mm²—850*560 mm² | |
Min-Max PCB thickness can be processed | 0.3mm--6mm | |
Max PCB WT can be processed | 6kg | |
Max types of materials can place up to the line | 500 | |
3D X-Ray | Gain | Geometric magnification 2000; system magnification 12000 |
Resolution | 1μm /nm | |
Rotation angle & tilt angle of view | any ±45°+360°Spin | |
AXI | Min components can be processed | 1005 |
Min detectable lead pitch | 0.4mm(QFP) | |
Min detectable tin thickness | 0.0127mm |