Шэньчжэнь музыкальные Музыкальные инструменты керамическая основа PCB OEM ODM печатные платы от производителя сборка сервис


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Характеристики



Company Introduction




PCB PROGRESS




SMT Progress
Item
Mass Production Capability
Solde Paste Print
Max PCB size can be processed
900*600mm²
Max PCB WT can be processed
8kg
±25μm
System calibration repeatability
±10μm
Squeegee pressure detection
Pressure closed loop control system
SPI (Solder Paste Inspection)
Min Detectable solder ball pitch
100μm
X-Y axis accuracy
0.5μm
False positive rate
≤0.1%
Mount
Min-Max machinable components
0.3*0.15 mm²--200*125 mm²
Max Height of machinable components
25.4mm
Max Weight of machinable components
100g
BGA/CSP Min ball spacing, ball diameter
0.30mm,0.15mm
Mount accuracy
±22μm),±0.05
Min-Max PCB size can be processed
50*50 mm²—850*560 mm²
Min-Max PCB thickness can be processed
0.3mm--6mm
Max PCB WT can be processed
6kg
Max types of materials can place up to the line
500
3D X-Ray
Gain
Geometric magnification 2000; system magnification 12000
Resolution
1μm /nm
Rotation angle & tilt angle of view
any ±45°+360°Spin
AXI
Min components can be processed
1005
Min detectable lead pitch
0.4mm(QFP)
Min detectable tin thickness
0.0127mm


















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